ISSCC 2026: NVIDIA & Broadcom CPO, HBM4 & LPDDR6, TSMC Active LSI, Logic-Based SRAM, UCIe-S and More

Treść źródłowa

There are three major semiconductor conferences each year, IEDM, VLSI and finally ISSCC. We have covered the former two in great detail over the past few years. Today, we finally complete the trinity with our roundup on ISSCC 2026. Compared to IEDM and VLSI, ISSCC has a much bigger focus on integration and circuits. Almost every paper comes with some form of circuit diagram, together with clear measurements and data.In past years, ISSCC findings have been hit or miss when it comes to industry impact. This year was different, a significant number of papers and presentations were directly relevant to market trends. Topics covered range from the latest advancements in HBM4, LPDDR6, GDDR7, and NAND, to co-packaged optics, advanced die-to-die interfaces, and advanced processors from the likes of MediaTek, AMD, Nvidia, and Microsoft.In this roundup, we will cover major categories such as Memory, Optical Networking, High-Speed Electrical Interconnects, Processors.MemoryOne key theme that caught our attention at this year’s ISSCC was memory, including Samsung HBM4, Samsung and SK Hynix LPDDR6, and SK Hynix GDDR7. Other than DRAM, logic-based SRAM and MRAM also piqued our interest.Samsung HBM4 - Paper 15.6Samsung was the only one among the top three memory vendors to present a technical paper on HBM4. Before ISSCC, we noted in our Accelerator & HBM model that Samsung had made great improvements in their HBM4 generation over their HBM3E. The data presented at ISSCC confirmed our analysis, with Samsung posting best-in-class performance - we have also detailed this development months a…